Flip-chip packaging method, the substrate itself is a printed circuit board, the chip is directly encapsulated in accordance with the fixed circuit board into the chip between the chip is independent, but because there is no like a positive connection through the wire for secondary connection, if Once a chip is dead, the entire light source will be extinguished, and the packaging process requirements are also high; in addition, because the chip is directly hit on the substrate and is directly cooled to the substrate, the heat dissipation effect will be better than that of a positive one.
Item | Power | Voltage | Luminous efficiency | CCT | CRI |
AL-D14-25W-220V | 25W | 120V/220V | 90-100lm/W | 2700-6500K | 70-90Ra |
AL-D14-35W-220V | 35W | 120V/220V | 90-100lm/W | 2700-6500K | 70-90Ra |
If you have interested in it, please advice any time!