Die Bonding is thin, good heat dissipation, high current is available.
The size can be smaller, to match the optical is easier.
Because of flip technology the heat dissipation is enhanced, it also improve the chip’s life; Antistatic capability is improved, too
Don't need bonding wire (gold wire, alloy wire) binding, it saves cost.
A production process is largely optimization, compared with the traditional integrated light source output time is reduced by 50%. The yield of product is 100%.
The bracket and the chip’s electrode solder joint are made of silver-plate copper structure, which is welded with nanometer-size solder paste. The bonding is firm, the thermal conductivity is better, the reflection efficiency is high, and the overall luminous efficiency of the light source is over 110LM/W
No gold wire package, low resistance loss , so it can make the chip under larger driving current, it is convenient for the customer to match application power flexibly.
The welding line in LED packaging process is the most prone to arise problems , more than 90% of the LED Lamp death is associated with welding line ,LED light source using flip chip technology without gold wire package , then it can completely solve the problem about dead lights, which greatly improves the stability of light source in various working conditions, this point in COB and the integrated light source is more important.
Item: LED COB Smart Chip
Watt: 30W ; 50W ;
Volt: 220-240V ;; 110V
Color Temperature: Cold White / Warm White
Color Rendering Index:>Ra80
Beam angle :160 degree
Feature: No Need Driver;;Smart IC;;Easy to DIY
How to use it: Connect 220-240V
Lifespan:over 10,000 hrs
Attention:It must need a heatsink aluminum for cooling, do not light it without heatsink aluminum.
If you have interested in it, please advice any time!!!