LED six technologies lead the future

- Oct 16, 2018-

LED six technologies lead the future

As a green industry, LED will further enhance the industrial concentration, and the superior resources will move closer to the dominant enterprises. New technologies are secretly exerted, and innovative technologies lead LEDs to carry out different situations.

First, the chip and packaging links are developing rapidly. Light efficiency is improving, and technologies such as flip chip, high voltage chip, COB, EMC, and CSP package have been developed. All domestic and foreign device products have begun to spell light source module components, especially IC integration products, system integration, modularization and so on. The COB devices below 30W are still the mainstream products in the market, and there is a possibility of a substantial increase in the future.

Second, although the device factory has thrown out the sound of developing CSP and flip-chip gold-free package in the past two years, it has finally become popular this year. Direct-type backlights, products for TV display already have CSP products. For example, the CSP package product is in the form of COB, and a plurality of small devices are combined in series, and can be assembled infinitely according to the application size. In addition, the market for phosphor products related to Gao Xianzhi this year is outstanding.

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Third, EMC devices are increasingly sought after in high-power industrial and mining lamps and floodlights. The development of automotive lighting modularization, market stability needs to be expanded, such as car headlights and turn signals are a very attractive market cake.

Fourth, intelligent lighting solutions, intelligent solutions for homes and businesses have become the market scent. Intelligent lighting is becoming more and more popular. It is a trend and a challenge. The current "App Light Control System" method, each product from the light to the software, the system is self-contained, there is no unified standard or agreement, can not be interconnected, this is the constraint A major drawback of development.

Fifth, the filament lamp is more mature. Many enterprises rely on technology leadership, production and sales all over the world, the market is loud, and the sapphire substrate filament has become the main product to replace the old-style silk lamp.

Sixth, more and more UV LED light applications, plant lighting applications, etc., the penetration rate is also higher, such as UV LED used in security, disinfection, curing and other fields. These LED segments have huge potential markets, but they all require large-scale applications to further exploit market opportunities.

Nowadays, the advantages of chip packaging technology appear, the industrial equipment is rapidly expanding, the display field is extended, the backlight is small and the pitch is leading, and the intelligent lighting is gradually leading. The scale of market segments such as plant lighting, medical lighting, and agricultural lighting is also gradually expanding and has been the focus of the industry.