What is the definition of COB integrated light source?
The COB integrated light source, ie chipOnboard, is to adhere the bare chip to the interconnect substrate with conductive or non-conductive glue, and then wire bonding to realize its electrical connection. The COB integrated light source is also called a COB surface light source.
COB integrated light source packaging process:
The COB integrated light source first covers the silicon wafer with a thermally conductive epoxy on the surface of the substrate, and then places the silicon wafer directly on the surface of the substrate, heat treatment until the silicon wafer is firmly fixed on the substrate, and then the silicon wafer is soldered. Establish an electrical connection directly with the substrate. There are two main types of bare chip technology: one is COB technology and the other is flip chip technology (FlipChip). Chip-on-board (COB), semiconductor chip is placed on the printed circuit board, and the electrical connection between the chip and the substrate is achieved by wire stitching. The electrical connection between the chip and the substrate is achieved by wire stitching and covered with resin to ensure reliability. . Although the COB integrated light source package is the simplest bare chip placement technology, its packaging density is far less than that of TAB and flip chip bonding.